The new high-performance modules deliver up to 180 TOPS of power-efficient computation designed for next-level AI ...

Explosive demand from Nvidia and other AI chipmakers has soaked up global memory supply, pushing DRAM and HBM prices to ...

High-bandwidth memory (HBM) is again in the limelight. At GTC 2025, held in San Jose, California, from 17 to 21 March, SK hynix displayed its 12-high HBM3E devices for artificial intelligence (AI) ...

The biggest challenge posed by AI training is in moving the massive datasets between the memory and processor.

Wide range of congatec modules support for computationally powerful, energy-efficient embedded AI applications SAN ...

The latest commodity coveted by the AI industry is computer memory, and the sector is signing deals directly with manufacturers for billions of dollars worth of chips – the very same chips that ...

A new chip-connection system could help topple the "memory wall," which limits computing speed and the growth of AI models today, by transferring data along reconfigurable pathways of light rather ...

AMD's all-new Zen 5 CPU core is going to debut with the launch of its "Strix Point" mobile processors in less than two weeks. However, those parts will largely be paired with soldered-down LPDDR5X ...

Memory chip prices surge 50% in Q1 2026 as AI demand exhausts supply. Micron, Samsung, SK Hynix sold out while laptop and ...

One of the biggest impacts of Apple's switch from Intel to its own M-series silicon -- debuting with the M1 in the 2020 MacBook Air, MacBook Pro and Mac Mini -- is faster, more stable, and more energy ...