MCLEAN, Va. & BEDFORD, Mass.--(BUSINESS WIRE)--The EMB3D Threat Model is now publicly available at https://emb3d.mitre.org. The model provides a cultivated knowledge base of cyber threats to embedded ...

BORDEAUX, France--(BUSINESS WIRE)--Luos, maintainer of an open source project for edge and embedded distributed systems, today simplified firmware updates – creating significant time savings, with the ...

At the beginning of 2024, mobile process and platform giant Qualcomm Technologies set out its stall for the year regarding how it would use on-device artificial intelligence (AI) to drive success in a ...

As may be obvious from some other threads, I've been delving down into the embedded programming world, and playing with small devices, programmed in C, that don't have much memory. I've become ...

At the 2012 DefCon security conference in Las Vegas, Ang Cui, an embedded device security researcher, previewed a tool for analyzing firmware, the foundational software that underpins any computer and ...

MITRE, in collaboration with researchers from three other organizations, this week released a draft of a new threat-modeling framework for makers of embedded devices used in critical infrastructure ...

When I first started experimenting with networks as a teenager, I was mostly driven by curiosity and the need to make things work better. I had no idea those experiments would become so relevant ...

Important cybersecurity standards and regulatory actions. The impact on automotive, medical, and consumer device development. Regulations in the EU. Deployment of robust embedded device security has ...

During a long afternoon at work you fuel up from the vending machine, which never seems to be out of your favorite soft drink thanks to a network connection that sends inventory information and ...

2022 has delivered abundant new evidence that industrial control systems are in the cross hairs of cyber attackers. Researchers investigating Indestroyer2 and Pipedream/Incontroller have confirmed ...

Embedding chips into stacked-die assemblies is creating thermal dissipation challenges that can reduce the reliability and lifespan of these devices, a growing problem as chipmakers begin cramming ...