Technology progression within advanced process control (APC) continues to evolve; however, it is the relationship among core APC developments, enabling technologies, and management practices that is ...

Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...

Marcus Hoversland, a UW graduate and process engineer at HF Sinclair in Casper, interacts with UW students in an “Intro to Chemical Engineering” class. UW has received a generous investment from HF ...