Abstract: The through silicon via (TSV) arrays play the role of vertical electrical interconnections in the 3-D stacked integrated circuits. However, the coupling crosstalk between the adjacent TSVs ...

LAS VEGAS (KTNV) — The time it takes to get to and from Harry Reid International Airport could be a little quicker with a new option for travelers: the Vegas Loop. If you're not familiar, the Vegas ...

Abstract: This study aimed to investigate the potential human-computer interaction factors (HCI) affecting students’ behavioural intentions (BI) to use the e-learning system and perceive success. This ...